Precision Micromachining
Sub-micron material removal for complex three-dimensional geometries in metals, technical ceramics, and high-performance polymers. Our ultrafast laser systems eliminate heat-affected zones and mechanical stress, preserving material properties right to the cut edge.
Surface Texturing & Patterning
Controlled modification of surface topography to achieve specific functional properties: enhanced adhesion for bonding applications, reduced friction in sliding contacts, or antimicrobial surface structures. All without removing bulk material or affecting dimensional tolerances.
Selective Laser Ablation
Precise removal of thin-film coatings and surface layers without damaging underlying substrates. Essential for photovoltaic cell isolation, display panel patterning, and multi-layer circuit board processing where selective material removal is required.
Ultrafast Drilling Solutions
High-aspect-ratio micro-holes with diameters from 10 to 500 microns through materials from optical glass to hardened tool steel. Percussion drilling for rapid throughput or trepanning for precise diameter control—both with minimal taper and zero cracking.
3D Laser Lithography
Direct-write additive manufacturing using two-photon polymerization to create true three-dimensional structures with sub-wavelength resolution. Enables fabrication of photonic crystals, metamaterials, and micro-optical components impossible through conventional lithography.
Laser Cleaning & Restoration
Non-contact removal of rust, paint, oxides, and organic contaminants without abrasives, chemicals, or substrate damage. Adjustable energy delivery allows selective removal of surface layers while preserving base material—critical for heritage conservation and precision maintenance.
